Cleanroom Facility Basel

Welcome to the D-BSSE Cleanroom Facility. With state-of-the-art tools and comprehensive processing knowledge, we offer the scientists means to fabricate complex microsystems, microelectromechanical systems (MEMS), and microfluidic systems.

Our mission:

• Provision of tools and processes to fabricate complex micro- and nanostructures
• Support of users with project-specific consulting and process development
  

As one of the first research cleanroom facilities in Switzerland, we have the capabilities to process substrate sizes up to 8 inches (200 mm) diameter.

Equipment

The cleanroom facility is equipped with state-of-the-art tools to perform thin-film deposition, etching processes and lithography (proximity and contact printing) with good reproducibility to fabricate complex microsystems.

Dry processing

Oxford Instruments Plasmalab 80+:

• Plasma Enhanced Chemical Vapor Deposition (PECVD)
• Deposition of SiO2, Si3N4, SiOxNy films

Oxford Instruments Plasmalab 100:

• Reactive Ion Etching (RIE) and Deep Reactive Ion Etching (DRIE)
• Etching of Si, SiO2, Si3N4, SiOxNy and organic materials
• Fabrication of high-aspect-ratio structures in silicon.
• Inductively-Coupled Plasma (ICP) option for up to 4 inch wafers

Oxford Instruments Ionfab 300LC:

• Ion Beam Deposition (IBD) and Ion Beam Etching (IBE)
• Deposition of metallic and nonmetallic materials
• Etching of metallic and nonmetallic films and substrates.
• Very good uniformity (etching and deposition)

Microwave plasma asher:

• Removal of photoresist masks and surface activation

Wet processing

Goller Reinraumtechnik wet benches:

• KOH bath (temperature controlled) for anisotropic silicon etching
• BHF bath (room temperature) for SiO2 etching
• Quick-dump-rinse bath for de-ionized water rinsing

Lithography

Karl Suss MABA8-Gen3 mask aligner:

• 1:1 pattern transfer from glass or foil masks (contact and proximity printing)
• Broadband illumination (350 – 450 nm wavelength)
• Alignment accuracy of 0.25 µm; optical resolution down to 0.5 µm

Goller Reinraumtechnik lithography wet benches:

• Substrate cleaning (Ultrasonic de-ionized water bath, Spin rinse dryer, QDR bath)
• Hotplates for dehydration, priming, soft and hard baking
• Spinner for developing and resist stripping

Polymer processing

• Separated area for polymer processing to avoid contamination of other processes.
• Spin coater, hotplates, degassing chamber: SU-8 and PDMS layer formation, casting and molding, packaging

Inspection and analysis

Optical microscopes:

• Nikon and Zeiss inspection microscopes
• Leica DM6000 chip scanning microscope

Surface and film analysis

• Veeco Dektak 150 stylus profilometer: film thickness and stress measurements
• KLA Tencor AlphaStep 200: film thickness measurements
• Four-point probe: resistivity measurement of metal films and semiconductors.
• Zeiss Axiotron: optical film thickness measurements
• Wafer prober: electrical tests on wafer level

Packaging

• ESEC 3088i Wire bonder: manual and automatic wire bonding
• Kulicke & Soffa 4526 manual wire bonder
• Flip-chip bonder
• Ultron Dicing-tape laminator
• Disco DAD3240 dicing saw
• Disco DCS1440 cleaning system

Peter Rimpf                    Jonathan Schmidli

Mattenstrasse 26            Mattenstrasse 26
4058 Basel                       4058 Basel
Switzerland                      Switzerland

+41 61 387 34 17             +41 61 387 32 12