Services

The BSSE cleanroom facility is open and acessible to external users. In addition, it offers a variety of services to industrial and academic customers. For more information on the avaliable equipment, see the Equipment page. In case of questions or specific requests, please contact us.

The offered services and technologies include:  

• Microtechnology fabrication and processing for a broad range of applications
• CMOS wafer and chip post-processing (from chip level to 8 inch wafers)
• Lithography of SU-8 and other thick films (e.g., for microfluidic applications) with maslk aligner and maskless system
  
• Dry (plasma) and wet etching processes (RIE with ICP)
  
• Deposition of dielectrics and metals (PECVD, Ion beam deposition)
  
• Electroplating of microstructures
  
• Wire bonding (manual and automatic)
  
• Electron microscopy and ion beam profiling (large-chamber cross-beam machine for wafers up to 8 inches
  
• High-resolution 3D printing and machining