Bonding and Dicing
In the bonding lab, we do back-end processing of CMOS devices and other chips.
Ultron Dicing Tape Laminator
- heated laminating chamber
- sample size up to 200 mm (8 inch)
Disco DAD3240 Dicing Saw
- Precise dicing of silicon, glass and other materials
- maximum sample size 8 inch diameter
Disco DCS1440 Cleaning System
- used for wafer cleaning and drying
Wirebonder ESEC 3100 Plus
- fully automatic bonder
- 25 μm gold wire