Bonding and Dicing
In the bonding lab, we do back-end processing of CMOS devices and other chips.
Ultron Dicing Tape Laminator:
- Heated laminating chamber
- Sample size up to 200 mm (8 inch)
In the bonding lab, we do back-end processing of CMOS devices and other chips.
Ultron Dicing Tape Laminator:
